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GC G-PREMIO BOND
GC G-PREMIO BOND
GC G-PREMIO BOND
GC G-PREMIO BOND

GC G-PREMIO BOND

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₹4,190.00 ₹4,600.00 -9%
Brand: GC
Product Code: GC-GPB
Availability: In Stock

GC G-PREMIO BOND

8thGeneration Bonding Agent (Non-HEMA)


GC G-Premio BOND

G-Premio BOND is a universal, 8th generation bonding agent that is compatible with total-etch, self-etch and selective etch techniques providing excellent versatility. It is perfectly adapted to all direct restorations and can also be used to repair indirect restorations without the use of primer. G-Premio BOND can also be used in combination with a silane when repairing glass or hybrid ceramic and is also ideal for hypersensitivity. It is available in a bottle (5 mL) with a new silicone cover to enable more precise drop dispensing.

 

 

Outstanding performance with all etching modes and in all clinical situations.

A unique combination of three functional monomers (4-MET, MDP and MDTP), notably excluding HEMA, ensures excellent stability and exceptional bond strengths not just to tooth tissue but to all indirect substrates, including composites, precious and non-precious metals, zirconia and alumina for all repair cases.

 Benefits:

  •  Low pH (1.5) provides effective and consistent bonding
  •  Use in all total-etch, self-etch and selective etch bonding techniques
  •  Low film thickness (3 microns) enables use with resin cements to bond indirect restorations
  •  Universal (8th generation) bonding agent for use in direct and indirect procedures and treatment of hypersensitivity
  • Up to 5 minutes working time
  • Consistent bond strength with easy application
  •  Better dispensing control and less waste with new silicone bottle design.
  •  Fast technique (10 second placement and 25 seconds before placing composite)

Packaging:

5ml bottle

KEY SPECIFICATIONS :

Store at room temperature (1-25°C) (33.8-77.0°F)

DIRECTIONS TO USE :

How to Use:

Leave undisturbed for 10 seconds after application. Dry thoroughly for 5 seconds under MAXIMUM air pressure and light cure for 10 seconds. For the selective etching approach, apply 35% – 40% phosphoric acid on enamel for 10 seconds prior to the application of the bonding.

 Application Time:

  • 30 seconds from application time to light-cure
  • Bonding Layer Thickness: Less than 3 µM

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